Burn and run in

These tests identify two causal sources of faults in assemblies and components. Early failures or total failures are detected with the burn-in test. Temporary failures under certain environmental conditions are recognised with the help of a run in test. By integrating a function test, the test specimens are permanently monitored. In the event of a fault, the date and time are recorded together with the event / result.
 
Burn in
The artificial ageing of assemblies and components serves the purpose of filtering out unavoidable early failures in the production process. These early failures are caused by component tolerances and production-related variances. Burn in is achieved by operating the assemblies and components statically at a higher temperature, e.g. 85°C.

Run In
For electronic assemblies and components that are exposed to high climatic requirements during their life cycle, the Run In Test offers excellent process control. The assemblies and components are actively operated during the process and subjected to a cyclical change in ambient temperature.

  • Volume 34 to 100 litres
  • Temperature ranges -75 to +180 °C
  • Humidity 10 to 98 % r. h.

Burn in PCB
Burn in PCB
Settings
Settings
Climate chamber
Climate chamber
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