DE
ENSMD taping
We tape electronic and mechanical components for automatic further processing. The feed is variable and can be in tubes, trays or as bulk material. Processing is carried out using semi-automatic or fully automatic blister taping machines with integrated vision systems.
- SO, SOP, SOT, SOIC, SOJ, SOMC, SSOPT
- TSOP / TSSOP / VSO,
- BGA, DFN, QFN, QFP
- D–PAK, D2–PAK
- Capacitors, resistors, diodes, coils
other possible housings and designs on request.
- Belt width 8 mm to 120 mm
- Tape depth 30 mm max.
- Hot and cold sealing